Ensights

Migration from 2D to 3D structures for high-density memory devices changes the nature of etching and deposition processes, especially as the number of layers for 3D NAND integration grows to 96 and beyond, and new process chemistries become commonplace. The greater number of lengthy processing steps and high aspect ratio (HAR) features involved place new demands on all steps of the chip manufacturing process, including etching, deposition, and cleaning equipment. Consistent process stability becomes harder to achieve.

Much as a bolt of lightning can strike in one spot and travel, creating a path of destruction in its wake, a single electrostatic discharge can have a similar effect on a semiconductor manufacturer’s bottom line. For advanced-node manufacturers, the risk posed by electrostatic discharge has become amplified by the move to fluoropolymers, a consequence of stainless-steel process tool components failing to meet increased purity requirements.

Entegris recently wrapped up an exciting week at the first-ever SEMICON West virtual event. The event provided a great opportunity to connect with the community and gain valuable insight into the future of the industry.

Photochemicals are playing an increasingly important role in bringing next generation devices to reality. While semiconductor manufacturing has always needed a pure, contamination-free environment, the requirements are tightening even further.

To meet increasing sensitivity to contaminants in integrated circuit (IC) manufacturing, semiconductor fabs have begun looking to their chemical suppliers to adopt new contamination control standards that improve quality and assist in reducing wafer defects. Each material has several touch points along the chemical manufacturing, storage, transport, and delivery journey that could add or generate contaminants. Semiconductor fabs seek assurance from their materials suppliers that they will minimize opportunities for contaminants to end up on a wafer (Figure 1). 

Ensuring Purity and Safety Purity requirements continue to tighten as the semiconductor manufacturers continue to pursue advanced technology nodes.  Of all the industries that rely on a consistent supply of both raw and specialty chemical, the semiconductor industry sets the highest bar.

Dewetting and non-dewetting are not common terms used every day, yet are vital to the functionality of liquid filters.

Entegris Highlights 2019 2019 was a year of exciting change and significant accomplishments for Entegris including strategic acquisitions, supplier awards, footprint expansions and technology center openings, sustained Five+ Sigma quality levels, hundreds of issued technology patents, and so much more!

Wetting the membrane is an important first step in preparing your filter. Wetting the membrane pores eliminates dry pathways where contaminants, like particles, gels, or bubbles could pass through, resulting in high defect levels in your process. Polymer membranes are natively hydrophobic or hydrophilic.