hero-654791312-sized

Ensights

Science that is transforming lives and enabling the future

Minimizing Filter Plugging: A Guide for Biologic Contamination Control Technologies

Minimizing Filter Plugging: A Guide for Biologic Contamination Control Technologies

Within the life sciences industry, controlling biological and micro contaminants in process streams is vital to improving operating efficiency and the enablement of technological advances such as modern drug development and monoclonal antibodies (mAbs). Sterile filtration plays a critical role in protecting vital bioprocesses and is the cornerstone in eliminating contaminants. But what happens when a filter gets plugged and how can you minimize impact on filtration performance?

  • November 1, 2022

Filtering Out the Noise: What You May Not Know About Everyday Purity

Whether it is a deliberate strategy or serendipity, the innovations that shape our lives are the result of skilled people put into the right environment to create something new. Innovation is not an exact science, but persistence and some good luck have yielded all the amazing tools and technology we rely upon.

  • August 4, 2022

Solid Precursors for 3D Architectures: Equipment

The expanding need for massive data storage and processing has driven the migration from 2D to 3D architectures for logic and memory chips. These complex architectures, with their high aspect ratio (HAR) designs and ultra-thin layers, are forcing advances in metal and oxide deposition processes. Atomic layer deposition (ALD) is usually the method of choice for producing uniform layers with precisely controlled composition.

  • June 6, 2022

Solid Precursors for 3D Architectures: Materials

Advanced 3D architectures for logic and memory devices increasingly rely on atomic layer deposition (ALD) to achieve high-quality, nanoscale conformal coatings. ALD deposits reactants and precursor molecules in alternating pulses to create the desired chemical makeup of the layers. Because of its ability to produce extremely thin films of uniform thickness and composition, ALD has supplanted physical vapor deposition (PVD) as the dominant deposition process for leading-edge technology nodes.

  • May 13, 2022

Next Generation Safe Delivery Source® Dopant Material Storage and Delivery Package

The Entegris Safe Delivery Source® (SDS®) package has been the leader in providing subatmospheric specialty gas storage and delivery for ion implant dopant materials since its inception more than twenty years ago.

  • February 15, 2022

CMP Defect Control for Bulk Slurry Manufacturing

The purpose of a CMP process is simple – to planarize the top layer of oxide or metal with an abrasive slurry. Manufacturing the slurry to the exacting standards required by the end user is not easy. To effectively planarize the wafer surfaces, both large and small abrasive particles must be removed prior to being dispensed. Thus, the target is a narrow particle size distribution between 30 and 200 nm to prevent both microscratches and underlayer defects.

  • February 7, 2022

Contamination Control Versatility

Simplify your operations and supply chain with a versatile contamination control strategy.

  • October 8, 2021

Case Study: On-Wafer Defect Reduction in Lithography

Overview The rapid increase of semiconductors in cars enables significant safety, connectivity, mobility, and sustainability improvements. As transportation transforms from being driver controlled to software controlled, automakers must look closer at their ability to measure and maintain product reliability throughout the vehicle’s lifetime.

  • September 8, 2021

High Purity PFA Tubing Overcomes PVC Pitfalls in Dual Containment Systems

A high purity sub-fab serves as the central nervous system of a semiconductor cleanroom. It houses chemical delivery, purification, recycling, and destruction systems. The sub-fab is where potentially hazardous aqueous chemistries and gases are stored and handled until they are delivered to the cleanroom process equipment located either in the floor above it or the building adjacent to it.

  • August 19, 2021

Advanced CMP of Silicon Carbide Supports an Expanding EV Market

The electric vehicle (EV) market is expanding in response to customer demand, with multiple major automotive companies offering lower cost models with longer driving range.

  • April 22, 2021

Precision Engineered Techniques for Coating Plasma Chamber Components

Migration from 2D to 3D structures for high-density memory devices changes the nature of etching and deposition processes, especially as the number of layers for 3D NAND integration grows to 96 and beyond, and new process chemistries become commonplace. The greater number of lengthy processing steps and high aspect ratio (HAR) features involved place new demands on all steps of the chip manufacturing process, including etching, deposition, and cleaning equipment. Consistent process stability becomes harder to achieve.

  • February 3, 2021

Defending Against Dangerous Electrostatic Discharge (ESD)

Much as a bolt of lightning can strike in one spot and travel, creating a path of destruction in its wake, a single electrostatic discharge can have a similar effect on a semiconductor manufacturer’s bottom line. For advanced-node manufacturers, the risk posed by electrostatic discharge has become amplified by the move to fluoropolymers, a consequence of stainless-steel process tool components failing to meet increased purity requirements.

  • September 22, 2020
    Content not found

    Related Posts