Entegris Offers New FOUP Form-Factors for Non-Standard Wafers Over the last few years, 3D stacking h...
Science that is transforming lives and enabling the future
Entegris Offers New FOUP Form-Factors for Non-Standard Wafers Over the last few years, 3D stacking has gone from a relatively niche fabrication method to an absolute necessity for cutting-edge applications. As chipmakers delve into smaller and smaller nodes, stacking and die-bonding wafers has become a preferred way of creating more processing power in a smaller space. Stacked and bonded wafers don’t behave the same way as 2D wafers: Wafers are thinned prior to bonding, which results in wafers that can sag when handled Bonded wafers are thicker and heavier than 2D wafers when assembled Bonded wafers can also warp following assembly Many automation tools rely on the predictable geometry and characteristics of 2D silicon wafers for safe handling and transport. While stacked and bonded wafers are a game-changer for miniaturization, they can also force manufacturing compromises unless chipmakers adopt specialized tools for the back end of the line (BEOL).
A Thermal Stability Study of Phosphoramidites Employed in Oligonucleotide Synthesis In the dynamic world of drug design, thermal stability plays a crucial role, often determining the success of innovative treatments. As researchers push the boundaries of medicine, the need for robust and effective RNA- and DNA-based drugs has never been greater. This is where the phosphoramidite method of DNA synthesis shines, but understanding the thermal stability of its components, especially phosphoramidites, is essential. In this blog, we will explore why thermal stability is vital in drug development, delve into a study focused on phosphoramidites, and discuss its implications for the field.
The use of silicon carbide (SiC) semiconductors offers a huge advantage for electric vehicles (EVs) due to lower switching losses and higher efficiencies, but cost has always been a drawback. SiC wafer manufacturing can suffer from high costs and lower yields, causing SiC semiconductors to cost up to eight times more than their silicon equivalents. This cost often gets passed on to the end customer, making EVs more expensive.
A “one size fits all” approach for chemical air filtration entails a productivity and safety risk in commercial environments reliant on pure air quality. Trying to use one type of chemical air filter for every scenario may provide protection, but without optimization the protection is both limited and temporary.
Entegris ESD Valves, Fittings, and Tubing: An Introduction
Airborne molecular contamination (AMC) is common to every environment. These contaminants are not physical particles such as those found in airborne dust or pathogens. AMC is gas molecules that are part of and move with air. These molecules are the result of outgassing or emissions from virtually anything that can be found in a given setting, from humans and animals to equipment, materials and processes, as well as external AMC sources. Sensitivity to these gases varies widely in each environment.
Consistent Gas Mixtures Minimize Implant Equipment Downtime
Entegris Offers New FOUP Form-Factors for Non-Standard Wafers Over the last few years, 3D stacking h...
A Thermal Stability Study of Phosphoramidites Employed in Oligonucleotide Synthesis In the dynamic w...
The use of silicon carbide (SiC) semiconductors offers a huge advantage for electric vehicles (EVs) ...
A “one size fits all” approach for chemical air filtration entails a productivity and safety risk in...
Entegris ESD Valves, Fittings, and Tubing: An Introduction
Airborne molecular contamination (AMC) is common to every environment. These contaminants are not ph...
Consistent Gas Mixtures Minimize Implant Equipment Downtime
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