Science that is transforming lives and enabling the future
Hydrogen composes about 75% by mass of the normal matter in the universe, existing as H2 gas under standard conditions. This abundance of supply creates opportunities in numerous applications, including semiconductor manufacturing, for which hydrogen is considered a bulk gas and is employed in many parts of the ecosystem.
Are you looking for a supply partner to help you scale cell and gene therapy (CGT) manufacturing? Do you need a partner that can help you keep up with pre-existing capacity increases? These challenges may lead to some hard choices.
Last year, Semiconductor Digest assembled six panelists from the world's leading semiconductor and automotive manufacturers and suppliers - including Volkswagen, Texas Instruments, Robert Bosch, Hyperion, and KLA, and Entegris - and asked them about the state of automotive electronics. They discussed issues such as the shift to automotive quad computing, the emphasis on infotainment, and the rise of alternative vehicle technologies such as electrification and self-driving.
Growth is good; no one in the semiconductor industry would argue this point. And according to Gartner, there’s a lot of “good” on the horizon. Current forecasts call for semiconductor sales to more than double in this decade, going from $400 billion in 2020 to $1T by 2030. With growth, however, come growing pains. To reach the heights of $1T-plus in semiconductor sales, the industry must evolve by significantly increasing not only the amount of wafers and wafer starts annually but also the amount of investment in equipment and materials. Semiconductor materials consumption during the same decade is expected to double as well. This creates great opportunity for materials suppliers, but it also will mean taking a hard look at the materials supply chain – what are the challenges, and how can they be addressed?
The growth of the biomanufacturing industry has created a demand for new and high-performance fluid handling systems and technologies for the management and storage of cell and gene therapy intermediates and gene-based medicines. New modalities come with risks that don’t yet have good solutions.
Changing one material in the semiconductor manufacturing process has a cascading effect on multiple process steps. Consider the replacement of tungsten (W) and copper (Cu) with molybdenum (Mo). Integrated device manufacturers (IDMs) are implementing Mo in advanced designs, focusing on 2-nanometer (nm) nodes and below. Mo is highly conductive, can be deposited without a titanium or titanium nitrid
Silicon carbide (SiC) has become popular with chipmakers. Its wide-bandgap structure offers many design benefits for the operations of power semiconductors. Compared to silicon, SiC wafers enable the fabrication of faster, more efficient devices that can both operate at higher temperatures and remain stable when deployed in extreme temperature environments. Processing SiC wafers using the same materials and methods as silicon wafers is not a viable option, however.
Powder can be a mess when not delt with properly. Have you ever dropped a bag of flour on the floor after coming home from the store? Cleaning up the mess is terrible (speaking from experience, don’t add water or you just make glue). Now imagine doing that in a manufacturing suite with powdered media. The powder is literally designed to grow cells, so anything you miss is just a new petri dish that can generate contamination. Plus, there’s the added challenge of having to validate that the room is clean after attending to the spill.
Entegris is delighted to announce our new interactive tool intended to help the life sciences industry better understand how we can support the entire drug manufacturing process. Our growing life sciences portfolio can be overwhelming for customers, and this simple tool helps guide them to finding all the ways we can help. The tool was designed to be versatile and can be shared by our team as part of a sales overview, or you can explore it yourself to quickly learn more about the solutions we offer.
If you asked a semiconductor process engineer to name their biggest challenge when tackling the next technology node, they would likely tell you it is figuring out how to achieve high device yields. This is mainly due to an increase in possible points of contamination as the number of potential contaminants grows and their sizes shrink. It is becoming particularly difficult to detect metal contaminants and pinpoint their root cause so they can be eliminated. That’s because they can form anywhere in the process flow.
In the early days of semiconductor manufacturing, fabs would remove contaminants from their process fluids in a sequence that could be analogized to making a cup of coffee. By using a filter with tiny pores, large contaminants (coffee grounds) are separated from water. Because the coffee grounds are too large to pass through the filter, they can’t pass into the coffee we drink.