Science that is transforming lives and enabling the future
Technologies like AI, IoT, and virtual reality are changing the way people live across the globe. To achieve the performance for these technologies, manufacturers have adopted new, more complex chip designs. These changes have increased the demands on the materials used in all steps of semiconductor processing.
Take a look at what we were up to during SEMICON West 2019. From our CEO's appointment as chairman of SEMI, to the launch of our interactive well-managed fab app, we had a busy couple of days.
Setting the stage Logic devices are getting smaller, and the introduction of 3D architectures that use vertical fins and nanowires in their gate design introduce more complexity to the fabrication process. As technology nodes shrink beyond 10 nm, new materials are required in both FEOL and BEOL processes to enable performance, yield, reliability and cost.
What are the toughest challenges lithographer's face to reduce process variations?
Lithographer’s face the challenge to translate designs into reproducible patterns that meet their yield, parametric performance, and reliability goals. Success or failure relies heavily on the controls in place that limit process variation. Recognizing and addressing all the sources of lithography pattern variations can preoccupy lithographers.
Listen as Dr. Mark Puttock, senior director, advanced technology engagements, explains how the semiconductor industry is adapting to 3D NAND memory challenges. From extreme high aspect ratio (HAR) processing, and the need for new chemical precursors and coatings Dr. Puttock discusses what it takes to achieve critical purity and contamination requirements.
Today, Entegris recognizes a milestone event in the semiconductor industry.