Science that is transforming lives and enabling the future
Much as a bolt of lightning can strike in one spot and travel, creating a path of destruction in its wake, a single electrostatic discharge can have a similar effect on a semiconductor manufacturer’s bottom line. For advanced-node manufacturers, the risk posed by electrostatic discharge has become amplified by the move to fluoropolymers, a consequence of stainless-steel process tool components failing to meet increased purity requirements.
The drive for ever more powerful microprocessors and greater memory storage places demands on all steps of the semiconductor wafer fabrication process. At some point, incremental improvements are no longer sufficient, and further device shrinking requires a completely different technology. The semiconductor industry is now experiencing this with lithography, where extreme ultraviolet (EUV) lithography is replacing 193 nm immersion (193i) lithography for more and more critical chip layers.
Entegris recently wrapped up an exciting week at the first-ever SEMICON West virtual event. The event provided a great opportunity to connect with the community and gain valuable insight into the future of the industry.
The rapid increase of semiconductors in cars enables significant safety, connectivity, mobility, and sustainability improvements. The standards to measure reliability under the tough conditions a car presents are based on how vehicles operate today. Conventional vehicles are generally idle 95% of the time. As a result, the expected lifetime of the electronics systems is well beyond the lifetime of the vehicle itself.
Entegris Highlights 2019 2019 was a year of exciting change and significant accomplishments for Entegris including strategic acquisitions, supplier awards, footprint expansions and technology center openings, sustained Five+ Sigma quality levels, hundreds of issued technology patents, and so much more!
Technologies like AI, IoT, and virtual reality are changing the way people live across the globe. To achieve the performance for these technologies, manufacturers have adopted new, more complex chip designs. These changes have increased the demands on the materials used in all steps of semiconductor processing.
Take a look at what we were up to during SEMICON West 2019. From our CEO's appointment as chairman of SEMI, to the launch of our interactive well-managed fab app, we had a busy couple of days.
Setting the stage Logic devices are getting smaller, and the introduction of 3D architectures that use vertical fins and nanowires in their gate design introduce more complexity to the fabrication process. As technology nodes shrink beyond 10 nm, new materials are required in both FEOL and BEOL processes to enable performance, yield, reliability and cost.