hero-654791312-sized

Ensights

Science that is transforming lives and enabling the future

Next Generation Safe Delivery Source® Dopant Material Storage and Delivery Package

All Posts

Next Generation Safe Delivery Source® Dopant Material Storage and Delivery Package

The Entegris Safe Delivery Source® (SDS®) package has been the leader in providing subatmospheric specialty gas storage and delivery for ion implant dopant materials since its inception more than twenty years ago.

As semiconductor devices advance, increased demands are placed on the purity, productivity, and safety of electronic gases. SDS4, the fourth generation of the SDS product line is designed to address these increasingly stringent demands.

blog-article-inline-12097-1200x600In our paper, “Next Generation Safe Delivery Source® (SDS®4) Dopant Material Storage and Delivery Package” we present key advancements in adsorbent-based packages for storing, handling, and delivering semiconductor dopant gases. Desirable characteristics and properties of adsorbents for use in this application are reviewed. The screening methodology and performance of various carbon and metal organic framework (MOF) adsorbents are evaluated against these characteristics.

Further discussion is included on the testing, design, and selection of cylinder features to continuously improve the SDS product line, making SDS4 the safest and highest performing sub-atmospheric storage and delivery package to- date. Final product performance is demonstrated and verified through beamline ion implantation tool data.

To read the full paper, visit Entegris website: Next Generation Safe Delivery Source® (SDS®4) Dopant Material Storage and Delivery Package

Authors: Christopher Scannell, Joseph Despres, Edward Sturm, Kavita Murthi, Oleg Byl – Entegris

Related Posts

Entegris Offers New FOUP Form-Factors for Non-Standard Wafers

Entegris Offers New FOUP Form-Factors for Non-Standard Wafers Over the last few years, 3D stacking has gone from a relatively niche fabrication method to an absolute necessity for cutting-edge applications. As chipmakers delve into smaller and smaller nodes, stacking and die-bonding wafers has become a preferred way of creating more processing power in a smaller space. Stacked and bonded wafers don’t behave the same way as 2D wafers: Wafers are thinned prior to bonding, which results in wafers that can sag when handled Bonded wafers are thicker and heavier than 2D wafers when assembled Bonded wafers can also warp following assembly Many automation tools rely on the predictable geometry and characteristics of 2D silicon wafers for safe handling and transport. While stacked and bonded wafers are a game-changer for miniaturization, they can also force manufacturing compromises unless chipmakers adopt specialized tools for the back end of the line (BEOL).

Entegris ESD Valves, Fittings, and Tubing: An Introduction

Entegris ESD Valves, Fittings, and Tubing: An Introduction

Gas Purifier Regeneration: Putting Circularity into Practice

Gas Purifier Regeneration: Putting Circularity into Practice