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Ensights

Science that is transforming lives and enabling the future

Case Study: On-Wafer Defect Reduction in Lithography

Case Study: On-Wafer Defect Reduction in Lithography

Overview The rapid increase of semiconductors in cars enables significant safety, connectivity, mobility, and sustainability improvements. As transportation transforms from being driver controlled to software controlled, automakers must look closer at their ability to measure and maintain product reliability throughout the vehicle’s lifetime.

  • September 8, 2021

Connecting Automotive and Semiconductor Supply Chains to Drive Functional Safety Excellence

Electronic devices now serve as the backbone of modern vehicles and have become the focus of quality standards that ensure automotive functional safety. As automakers transform their organizations to adapt and become experts in manufacturing digital machines, current gaps in how the automotive and semiconductor supply chains interact have emerged.

  • September 2, 2021

High Purity PFA Tubing Overcomes PVC Pitfalls in Dual Containment Systems

A high purity sub-fab serves as the central nervous system of a semiconductor cleanroom. It houses chemical delivery, purification, recycling, and destruction systems. The sub-fab is where potentially hazardous aqueous chemistries and gases are stored and handled until they are delivered to the cleanroom process equipment located either in the floor above it or the building adjacent to it.

  • August 19, 2021

Yield Advantages Through Maintaining and Upgrading FOUP Populations

One of the longest held beliefs in semiconductor manufacturing is that yield is the single most import­ant factor in overall wafer processing costs. Even incremental yield increases can significantly reduce manufacturing cost per wafer, or cost per square centimeter of silicon. As such, yield improvement is critical to any successful semiconductor operation. As semiconductor device nodes continue to scale, and 7 nm lines are ramping to production, this belief continues to ring true.

  • June 14, 2021

Synergistic CMP Systems Improve Yield

Shrinking feature size, advances in interconnect metals, and the need for ever tighter defectivity control all point to the growing importance of chemical mechanical planarization (CMP) to optimize fab yields. More layers of each chip require CMP to achieve planarity specifications, and contamination must be kept to a minimum.

  • June 9, 2021

Examining Chip Manufacturing Challenges for Advanced Logic Architecture

The Fourth Industrial Revolution is surrounding us with extraordinary technologies that did not exist a few years ago. Autonomous vehicles are already being tested on public streets. Drones range from simple adolescent playthings to short- and long-range military and civilian purposes like surveying landforms, shooting movies, and delivering packages. Vast amounts of video content, created by professionals and amateurs alike, are being filmed, streamed, and stored. Surveillance, both fixed and mobile, is becoming commonplace, server farms are bigger than ever, and 4G networks are being supplemented or replaced with 5G. What all these trends have in common is that they generate enormous amounts of data that must be processed, transported, and stored faster and more reliably than ever before.

  • May 26, 2021

Advanced CMP of Silicon Carbide Supports an Expanding EV Market

The electric vehicle (EV) market is expanding in response to customer demand, with multiple major automotive companies offering lower cost models with longer driving range.

  • April 22, 2021

Congratulations to Our 2020 Inventors and IP Award Winners!

To keep pace with the global demand and the rapid advancements in technology, the microelectronics industry depends heavily on innovating new solutions and processes to enable accelerated device production and performance. At Entegris, we are very proud to honor nearly 200 employees from our global technical community for their inventions and contributions to our intellectual property in 2020.

  • April 8, 2021

Precision Engineered Techniques for Coating Plasma Chamber Components

Migration from 2D to 3D structures for high-density memory devices changes the nature of etching and deposition processes, especially as the number of layers for 3D NAND integration grows to 96 and beyond, and new process chemistries become commonplace. The greater number of lengthy processing steps and high aspect ratio (HAR) features involved place new demands on all steps of the chip manufacturing process, including etching, deposition, and cleaning equipment. Consistent process stability becomes harder to achieve.

  • February 3, 2021

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