Ensights

One of the longest held beliefs in semiconductor manufacturing is that yield is the single most import­ant factor in overall wafer processing costs. Even incremental yield increases can significantly reduce manufacturing cost per wafer, or cost per square centimeter of silicon. As such, yield improvement is critical to any successful semiconductor operation. As semiconductor device nodes continue to scale, and 7 nm lines are ramping to production, this belief continues to ring true.

Shrinking feature size, advances in interconnect metals, and the need for ever tighter defectivity control all point to the growing importance of chemical mechanical planarization (CMP) to optimize fab yields. More layers of each chip require CMP to achieve planarity specifications, and contamination must be kept to a minimum.

The Fourth Industrial Revolution is surrounding us with extraordinary technologies that did not exist a few years ago. Autonomous vehicles are already being tested on public streets. Drones range from simple adolescent playthings to short- and long-range military and civilian purposes like surveying landforms, shooting movies, and delivering packages. Vast amounts of video content, created by professionals and amateurs alike, are being filmed, streamed, and stored. Surveillance, both fixed and mobile, is becoming commonplace, server farms are bigger than ever, and 4G networks are being supplemented or replaced with 5G. What all these trends have in common is that they generate enormous amounts of data that must be processed, transported, and stored faster and more reliably than ever before.

The electric vehicle (EV) market is expanding in response to customer demand, with multiple major automotive companies offering lower cost models with longer driving range.

Most equipment and process engineers become experts at analyzing a wafer map to quickly identify signatures indicating when their equipment or process was the perpetrator of a maverick yield event. But as defect signatures become more subtle and harder to quickly identify, there is a significant need to consider not just what in-line inspection systems are identifying, but specifically what they are not identifying. 

The drive for ever more powerful microprocessors and greater memory storage places demands on all steps of the semiconductor wafer fabrication process. At some point, incremental improvements are no longer sufficient, and further device shrinking requires a completely different technology. The semiconductor industry is now experiencing this with lithography, where extreme ultraviolet (EUV) lithography is replacing 193 nm immersion (193i) lithography for more and more critical chip layers.

NEW PARADIGMS IN MATERIALS DEPOSITION FOR BOTH LOGIC AND MEMORY DEVICE MANUFACTURING We live in an increasingly connected world that has developed an almost unquenchable thirst for data. To process this raw data into something that is actionable requires the most advanced artificial intelligence (AI) chips for a multitude of applications, from machine learning and autonomous vehicles, to smart cities and efficient energy sources. The quest to develop these devices is driving integrated device manufacturers (IDMs) to push semiconductor manufacturing technology to its very limits.

Entegris recently wrapped up an exciting week at the first-ever SEMICON West virtual event. The event provided a great opportunity to connect with the community and gain valuable insight into the future of the industry.

Photochemicals are playing an increasingly important role in bringing next generation devices to reality. While semiconductor manufacturing has always needed a pure, contamination-free environment, the requirements are tightening even further.