Ensights

If you asked a semiconductor process engineer to name their biggest challenge when tackling the next technology node, they would likely tell you it is figuring out how to achieve high device yields. This is mainly due to an increase in possible points of contamination as the number of potential contaminants grows and their sizes shrink. It is becoming particularly difficult to detect metal contaminants and pinpoint their root cause so they can be eliminated. That’s because they can form anywhere in the process flow.

In the early days of semiconductor manufacturing, fabs would remove contaminants from their process fluids in a sequence that could be analogized to making a cup of coffee. By using a filter with tiny pores, large contaminants (coffee grounds) are separated from water. Because the coffee grounds are too large to pass through the filter, they can’t pass into the coffee we drink.

Biopharma manufacturing is an essential part of the healthcare industry, producing lifesaving treatments for patients around the world. Traditional manufacturing methods can have a significant environmental impact driven by stainless steel equipment requiring extensive cleaning and sterilization processes that consume substantial amounts of water and energy in addition to cleaning agents.

For decades, the semiconductor device manufacturing mantra was “How do we make them smaller, cheaper, and faster?” The pursuit of Moore’s Law – the doubling of transistors on a chip every two years – was achieved through planar scaling. But that approach could only go on for so long. The mantra now is “How do we improve power, performance, area, and cost (PPAC)?” At the 14 nm node, it was clear that the best way to push the limits of semiconductor device PPAC was to take it into the third dimension.

Things are not always as they appear. Take semiconductor manufacturing. On the surface, it may seem that the secret to making semiconductor devices more advanced lies in the design. But just as an architect’s design for a building may not be structurally feasible without the right materials, a semiconductor device design may not be functional if the materials and their interactions are not considered and optimized.

By: Mike Lamach, Reach-In Sales Leader, FARRAR™ | Trane Technologies The explosion of needs for -80°C through -60°C assets over the past decade has been nothing short of remarkable. Clinical research investments keep expanding while commercial-scale needs continue to transform the landscape.

Here’s a challenge, say the number 9 out loud, nine times. 9, 9, 9, 9, 9, 9, 9, 9, 9.

To wrap up the Year of the Tiger (2022), there are still lessons to be learned from the animal kingdom. A tiger out in the open roaming the savannah is at risk of injuries from predators, including human hunters. Wafers left out in the open in a fab are susceptible to damage that can cause dramatic yield drops. The larger the wafer diameter, the greater the risk.

As the chief technologist for the Life Sciences Division at Trane Technologies, Scott Farrar knows a thing or two about ultra-low temperature control for the life sciences industry, perhaps drawing inspiration from his days at Penn State University enjoying peach ice cream. Scott’s biggest inspiration, however, was his entrepreneurial dad who started a solar equipment company, teaching Scott from a young age the importance of sciences, technology, engineering, and mathematics (STEM) education and solving problems. Scott carried those tools with him, and upon completing his formal education, went to work for a pharmaceutical manufacturing company in research and development, specializing in low-temp freezers and incubators as well as heat-momentum and mass-transfer-type processes for the pharmaceutical industry. His exposure to dilemmas and investigative approach is what drove him to create better customer experiences.

What do plasma chamber components have to do with deer or wild boar? These animals are potential sources of food for the tiger. The components are potential sources of contamination in the fab. Success in both cases relies on attention to detail and a flexible strategy. Whether you are chasing prey or particle contamination, a multi-pronged approach is best.

Entegris is proud to announce a new relationship with Farrar Scientific, by Trane Technologies – a global climate innovator. Farrar offers best-in-class operating systems for ultra-cold temperature storage and controlled rate freeze/thaw chambers for pharmaceutical, biotech, and biorepository applications. Entegris offers the best-in-class Aramus™ bag for robust cold storage and transport. Collaborating with Farrar enables Entegris to offer a combined solution that accelerates the freeze/thaw process.