Science that is transforming lives and enabling the future
Migration from 2D to 3D structures for high-density memory devices changes the nature of etching and deposition processes, especially as the number of layers for 3D NAND integration grows to 96 and beyond, and new process chemistries become commonplace. The greater number of lengthy processing steps and high aspect ratio (HAR) features involved place new demands on all steps of the chip manufacturing process, including etching, deposition, and cleaning equipment. Consistent process stability becomes harder to achieve.
NEW PARADIGMS IN MATERIALS DEPOSITION FOR BOTH LOGIC AND MEMORY DEVICE MANUFACTURING We live in an increasingly connected world that has developed an almost unquenchable thirst for data. To process this raw data into something that is actionable requires the most advanced artificial intelligence (AI) chips for a multitude of applications, from machine learning and autonomous vehicles, to smart cities and efficient energy sources. The quest to develop these devices is driving integrated device manufacturers (IDMs) to push semiconductor manufacturing technology to its very limits.
Entegris is excited to celebrate the 50th anniversary of SEMI by coming together for the landmark virtual event to reaffirm our commitment to creating unique value for our customers and partners.
Photochemicals are playing an increasingly important role in bringing next generation devices to reality. While semiconductor manufacturing has always needed a pure, contamination-free environment, the requirements are tightening even further.
DRAM architecture has remained virtually unchanged for the past decade, with the dimensions shrinking proportionally with each successive device node. This linear path, however, is reaching its limits for nodes below 20 nanometers (nm) including 1x, 1y, 1z, 1a, and 1b. A major change will be needed soon if DRAM is to keep up with advances in logic.
The rapid increase of semiconductors in cars enables significant safety, connectivity, mobility, and sustainability improvements. The standards to measure reliability under the tough conditions a car presents are based on how vehicles operate today. Conventional vehicles are generally idle 95% of the time. As a result, the expected lifetime of the electronics systems is well beyond the lifetime of the vehicle itself.
Ensuring Purity and Safety Purity requirements continue to tighten as the semiconductor manufacturers continue to pursue advanced technology nodes. Of all the industries that rely on a consistent supply of both raw and specialty chemical, the semiconductor industry sets the highest bar.
During the semiconductor manufacturing process, contamination can be introduced from the air, equipment, cleanroom personnel, process water, process chemicals, and process gases.1 Careful identification of the contaminant source is required to best identify mitigation strategies that utilize filtration. Installing a filter can reduce defectivity, but this mitigation strategy will not indefinitely protect a gas stream from contamination.
The desire for ever more computing power in a smaller footprint requires transistors that perform faster while consuming less power. However, new materials and architectures developed with these goals in mind are not easy to transfer from research and development to full-scale, high-volume production.