hero-654791312-sized

Ensights

Science that is transforming lives and enabling the future

Join Entegris at SEMICON West 2020 Virtual Event

All Posts

Join Entegris at SEMICON West 2020 Virtual Event

Entegris is excited to celebrate the 50th anniversary of SEMI by coming together for the landmark virtual event to reaffirm our commitment to creating unique value for our customers and partners.

We hope to see you at our virtual exhibit, and we invite you to join our talk at the SEMI Smart Mobility Forum, where Wenge Yang, VP of market strategy, will present the ‘New Collaborative Approach.’ Learn about the new model of engagement that targets contamination control to improve automotive defectivity and reliability.

Throughout the week, Entegris will also be offering a series of free live discussions, including the following live keynote presentations:


Live Keynote Presentations:

Entegris Technology Forum: Acceleration of the Materials Era
July 21, 2020 I 3:00 - 4:00 PM PST

The semiconductor industry is predicted to be one of the fastest growing industries post-pandemic, with all segments benefiting from the accelerated demand. Join Entegris SVP and Chief Technology Officer, Jim O’Neill for a discussion on the increasing materials intensity in the era of EUV, vertical scaling, automotive, and more.REGISTER NOW!

Entegris Supply Chain Forum
July 22, 2020 I 3:00 - 4:00 PM PST

In the face of a global pandemic and explosive growth of industry megatrends, semiconductor fabricators are navigating complex and novel challenges to ensure a reliable and sustainable supply chain. Join Neil Richards, SVP global operations and supply chain, and Sandy Gauthier, VP global supply management for a discussion on navigating supply chain challenges and ensuring customer continuity.

REGISTER NOW!


For more live events and/or information, please
visit our event site. We look forward to connecting soon!

Related Posts

Entegris Offers New FOUP Form-Factors for Non-Standard Wafers

Entegris Offers New FOUP Form-Factors for Non-Standard Wafers Over the last few years, 3D stacking has gone from a relatively niche fabrication method to an absolute necessity for cutting-edge applications. As chipmakers delve into smaller and smaller nodes, stacking and die-bonding wafers has become a preferred way of creating more processing power in a smaller space. Stacked and bonded wafers don’t behave the same way as 2D wafers: Wafers are thinned prior to bonding, which results in wafers that can sag when handled Bonded wafers are thicker and heavier than 2D wafers when assembled Bonded wafers can also warp following assembly Many automation tools rely on the predictable geometry and characteristics of 2D silicon wafers for safe handling and transport. While stacked and bonded wafers are a game-changer for miniaturization, they can also force manufacturing compromises unless chipmakers adopt specialized tools for the back end of the line (BEOL).

Entegris ESD Valves, Fittings, and Tubing: An Introduction

Entegris ESD Valves, Fittings, and Tubing: An Introduction

Gas Purifier Regeneration: Putting Circularity into Practice

Gas Purifier Regeneration: Putting Circularity into Practice