Science that is transforming lives and enabling the future

Join Entegris at SEMICON West 2020 Virtual Event

All Posts

Join Entegris at SEMICON West 2020 Virtual Event

Entegris is excited to celebrate the 50th anniversary of SEMI by coming together for the landmark virtual event to reaffirm our commitment to creating unique value for our customers and partners.

We hope to see you at our virtual exhibit, and we invite you to join our talk at the SEMI Smart Mobility Forum, where Wenge Yang, VP of market strategy, will present the ‘New Collaborative Approach.’ Learn about the new model of engagement that targets contamination control to improve automotive defectivity and reliability.

Throughout the week, Entegris will also be offering a series of free live discussions, including the following live keynote presentations:

Live Keynote Presentations:

Entegris Technology Forum: Acceleration of the Materials Era
July 21, 2020 I 3:00 - 4:00 PM PST

The semiconductor industry is predicted to be one of the fastest growing industries post-pandemic, with all segments benefiting from the accelerated demand. Join Entegris SVP and Chief Technology Officer, Jim O’Neill for a discussion on the increasing materials intensity in the era of EUV, vertical scaling, automotive, and more.REGISTER NOW!

Entegris Supply Chain Forum
July 22, 2020 I 3:00 - 4:00 PM PST

In the face of a global pandemic and explosive growth of industry megatrends, semiconductor fabricators are navigating complex and novel challenges to ensure a reliable and sustainable supply chain. Join Neil Richards, SVP global operations and supply chain, and Sandy Gauthier, VP global supply management for a discussion on navigating supply chain challenges and ensuring customer continuity.


For more live events and/or information, please
visit our event site. We look forward to connecting soon!

Related Posts

Transitioning from Predictable to Pervasive Defectivity

Most equipment and process engineers become experts at analyzing a wafer map to quickly identify signatures indicating when their equipment or process was the perpetrator of a maverick yield event. But as defect signatures become more subtle and harder to quickly identify, there is a significant need to consider not just what in-line inspection systems are identifying, but specifically what they are not identifying. 

Defending Against Dangerous Electrostatic Discharge (ESD)

Much as a bolt of lightning can strike in one spot and travel, creating a path of destruction in its wake, a single electrostatic discharge can have a similar effect on a semiconductor manufacturer’s bottom line. For advanced-node manufacturers, the risk posed by electrostatic discharge has become amplified by the move to fluoropolymers, a consequence of stainless-steel process tool components failing to meet increased purity requirements.

Solving Defect Challenges in the EUV Process

The drive for ever more powerful microprocessors and greater memory storage places demands on all steps of the semiconductor wafer fabrication process. At some point, incremental improvements are no longer sufficient, and further device shrinking requires a completely different technology. The semiconductor industry is now experiencing this with lithography, where extreme ultraviolet (EUV) lithography is replacing 193 nm immersion (193i) lithography for more and more critical chip layers.