Science that is transforming lives and enabling the future

Zero-Defect Collaborations in the Autonomous Vehicle Supply Chain

All Posts

Zero-Defect Collaborations in the Autonomous Vehicle Supply Chain

The automotive supply chain is transforming with the development of autonomous vehicles. The rise of electronic systems leads designers and manufacturers to seek collaboration partnerships.


Antoine Amade, senior director EMEA/NA sales, was recently interviewed by SEMI to discuss the zero-defect challenges facing semiconductor fabs and the expansion of the GAAC (Global Automotive Advisory Council).

Minimizing latent defects is now a top priority in semiconductor fabs. However, there is a gap between visible and non-visible defects. Although fabs can detect small defects, human intervention is still needed to manage them. We are witnessing a fundamental shift in the contamination control strategy in auto chip production, from contamination control for yield to contamination control for reliability”, said Amade.


Visit the SEMI blog to learn more about the GAAC, and to watch the full interview.

Visit our automotive reliability page to learn more about the New Collaborative Approach and our contaminant management solutions, www.entegris.com/automotive.

Related Posts

Join Entegris at SEMICON West 2020 Virtual Event

Entegris is excited to celebrate the 50th anniversary of SEMI by coming together for the landmark virtual event to reaffirm our commitment to creating unique value for our customers and partners.

Pump it Up: Photochemical Delivery that Meets the Challenges of 3D Architectures

Photochemicals are playing an increasingly important role in bringing next generation devices to reality. While semiconductor manufacturing has always needed a pure, contamination-free environment, the requirements are tightening even further.

DRAM: Device Fabrication

DRAM architecture has remained virtually unchanged for the past decade, with the dimensions shrinking proportionally with each successive device node. This linear path, however, is reaching its limits for nodes below 20 nanometers (nm) including 1x, 1y, 1z, 1a, and 1b. A major change will be needed soon if DRAM is to keep up with advances in logic.