Wrapping up the First Ever SEMICON West 2020 Virtual Event

Entegris recently wrapped up an exciting week at the first-ever SEMICON West virtual event. The event provided a great opportunity to connect with the community and gain valuable insight into the future of the industry.

From July 20 – 23, we welcomed nearly 500 visitors to our virtual booth, and over 200 joined our live, interactive webinars. If you missed us, we invite you to view our recorded sessions by REGISTERING FOR FREE below:

ENTEGRIS TECHNOLOGY FORUM: Acceleration of the Materials Era

Join Entegris SVP and Chief Technology Officer, Jim O’Neill in this recorded webinar as he discusses:

Effects of COVID-19 on semiconductor growth
Increasing materials intensity in the era of materials advancement and putting it all together.This presentation is moderated by Wenge Yang, VP of market strategy, and includes live Q&A with Entegris technology experts.

Polishing Chemically Inert and Mechanically Hard Materials

As new materials are being introduced into semiconductor manufacturing, new CMP techniques are needed to address challenges with material hardness and chemical inertness.

In this recorded webinar, Dr. Rajiv Singh, VP, CMP slurries, addresses methods to achieve high polish rates and enhanced surface finish in silicon carbide, gallium nitride, sapphire, and carbon-based materials.

Effective Slurry Concentration Monitoring Using Refractive Index

Understanding the amount of solids in slurry is critical to determining an accurate Material Removal Rate (MRR) for CMP solutions. Index of Refraction (IoR) technology enables concentration monitoring of turbid and nonconductive materials.

Join Tracy Gast, global applications engineer, in this recorded webinar as he introduces a new liquid concentration monitor based on IoR technology that offers high accuracy and repeatability with an optional automated in situ window cleaner to ensure measure stability over time.

Enabling Yield Advantages

A semiconductor manufacturer may have a fleet of FOUPs that handle wafers hundreds of times throughout the manufacturing process. These microenvironments are trusted to be free of contaminants and conductance, but like any other mechanical object they have parts that wear over time.

Join Yossi Lax, global service manager and technology specialist, in this recorded webinar to learn the best methods for properly maintaining FOUP fleets to increase yield.

Entegris Supply Chain Forum

Join Neil Richards, SVP global operations and supply chain, and Sandy Gauthier, VP global supply management as they discuss:

The purity roadmap for materials and filtration
Navigating supply chain challenges resulting from COVID-19
Collaboration and localization to ensure continuity

This presentation is followed by live Q&A with Entegris operational experts.

SEMI has also made their virtual platform available through September 20, so there is still time to check it out by registering here!

Exploring the Superiority of Silicon Carbide in Optical Components

Exploring the Superiority of Silicon Carbide in Optical Components Silicon carbide (SiC) is a leading material for high-performance optical components, offering numerous advantages over traditional materials such as glass and metal. Its exceptional specific stiffness, high thermal conductivity, and outstanding dimensional stability position SiC as a superior choice compared to beryllium and low-expansion glass ceramics. Historically, the high costs associated with the preliminary shaping and final finishing of SiC have hindered its widespread adoption in optical systems. The material is both hard and strong, requiring precision machining with expensive diamond tooling on high-quality, rigid machine tools. However, advances in manufacturing techniques, such as near-net-shape slip casting, have demonstrated success in reducing costs despite necessitating significant diamond grinding. Building on this success, Entegris offers an entirely new way of creating SiC. Using our chemical vapor conversion process, we can create net- or near net-shaped SiC components in complex forms while spending much less time on fabrication.

Entegris

January 6, 2025

Entegris Offers New FOUP Form-Factors for Non-Standard Wafers

Entegris Offers New FOUP Form-Factors for Non-Standard Wafers Over the last few years, 3D stacking has gone from a relatively niche fabrication method to an absolute necessity for cutting-edge applications. As chipmakers delve into smaller and smaller nodes, stacking and die-bonding wafers has become a preferred way of creating more processing power in a smaller space. Stacked and bonded wafers don’t behave the same way as 2D wafers: Wafers are thinned prior to bonding, which results in wafers that can sag when handled Bonded wafers are thicker and heavier than 2D wafers when assembled Bonded wafers can also warp following assembly Many automation tools rely on the predictable geometry and characteristics of 2D silicon wafers for safe handling and transport. While stacked and bonded wafers are a game-changer for miniaturization, they can also force manufacturing compromises unless chipmakers adopt specialized tools for the back end of the line (BEOL).

Entegris

November 20, 2024

Mastering the SiC Wafer Transition

The use of silicon carbide (SiC) semiconductors offers a huge advantage for electric vehicles (EVs) due to lower switching losses and higher efficiencies, but cost has always been a drawback. SiC wafer manufacturing can suffer from high costs and lower yields, causing SiC semiconductors to cost up to eight times more than their silicon equivalents. This cost often gets passed on to the end customer, making EVs more expensive.

Entegris

November 12, 2024

Ensights