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2019 End of Year Highlights

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2019 End of Year Highlights

Entegris Highlights 2019

2019 was a year of exciting change and significant accomplishments for Entegris including strategic acquisitions, supplier awards, footprint expansions and technology center openings, sustained Five+ Sigma quality levels, hundreds of issued technology patents, and so much more!

View it all in our highlight reel!

 

 

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Transitioning from Predictable to Pervasive Defectivity

Most equipment and process engineers become experts at analyzing a wafer map to quickly identify signatures indicating when their equipment or process was the perpetrator of a maverick yield event. But as defect signatures become more subtle and harder to quickly identify, there is a significant need to consider not just what in-line inspection systems are identifying, but specifically what they are not identifying. 

Defending Against Dangerous Electrostatic Discharge (ESD)

Much as a bolt of lightning can strike in one spot and travel, creating a path of destruction in its wake, a single electrostatic discharge can have a similar effect on a semiconductor manufacturer’s bottom line. For advanced-node manufacturers, the risk posed by electrostatic discharge has become amplified by the move to fluoropolymers, a consequence of stainless-steel process tool components failing to meet increased purity requirements.

Solving Defect Challenges in the EUV Process

The drive for ever more powerful microprocessors and greater memory storage places demands on all steps of the semiconductor wafer fabrication process. At some point, incremental improvements are no longer sufficient, and further device shrinking requires a completely different technology. The semiconductor industry is now experiencing this with lithography, where extreme ultraviolet (EUV) lithography is replacing 193 nm immersion (193i) lithography for more and more critical chip layers.