---
title: "Hear from the Expert: 3D NAND Challenges"
description: Entegris discusses the challenges to 3D NAND technology.
---

[Entegris Blog | Ensights](https://blog.entegris.com)

# [Hear from the Expert: 3D NAND Challenges](https://blog.entegris.com/expert-opinion-3d-nand-challenges)

 Written by [Entegris](https://blog.entegris.com/author/entegris) | Apr 23, 2019

Listen as Dr. Mark Puttock, senior director, advanced technology engagements, explains how the semiconductor industry is adapting to 3D NAND memory challenges. From extreme high aspect ratio (HAR) processing, and the need for new chemical precursors and coatings Dr. Puttock discusses what it takes to achieve critical purity and contamination requirements. 

Interested in learning more about 3D NAND technology? Visit Entegris' 3D NAND thought leadership page [here](https://www.entegris.com/content/en/pure/3d-nand-solutions.html).

[View full post](https://blog.entegris.com/expert-opinion-3d-nand-challenges)

```json
{
  "@context" : "http://schema.org",
  "@type" : "BlogPosting",
  "author" : {
    "@type" : "Person",
    "name" : "Entegris"
  },
  "dateModified" : "2019-05-21T17:52:23.914Z",
  "datePublished" : "2019-04-23T13:16:13Z",
  "headline" : "Hear from the Expert: 3D NAND Challenges",
  "image" : {
    "@type" : "ImageObject",
    "height" : 1351,
    "url" : "https://cdn2.hubspot.net/hubfs/4669942/3d-nand-structure-07.jpg",
    "width" : 2201
  },
  "mainEntityOfPage" : "https://blog.entegris.com/expert-opinion-3d-nand-challenges",
  "publisher" : {
    "@type" : "Organization",
    "logo" : {
      "@type" : "ImageObject",
      "height" : 60,
      "url" : "/hs/hsstatic/content_shared_assets/static-1.4092/img/default-amp-logo.png",
      "width" : 60
    },
    "name" : "Ensights"
  }
}
```